Integration of thin-film-fracture-based nanowires into microchip fabrication.

One-step device fabrication through the integration of nanowires (NWs) into silicon microchips is still under intensive scientific study as it has proved difficult to obtain a reliable and controllable fabrication technique. So far, the techniques are either costly or suffer from small throughput. Recently, a cost-effective method based on thin-film fracture that can be used as a template for NW fabrication was suggested.