Plasmonic nanostructures serve as optical antennas for concentrating the energy of incoming light in localized hotspots close to their surface. By positioning nanoemitters in the antenna hotspots, energy transfer is enabled, leading to novel hybrid antenna-emitter-systems, where the antenna can be used to manipulate the optical properties of the nano-objects. The challenge remains how to precisely position emitters within the hotspots.
View Article and Find Full Text PDFIn scanning electron microscopy (SEM), imaging nanoscale features by means of the cross-sectioning method becomes increasingly challenging with shrinking feature sizes. However, obtaining high quality images, at high magnification, is crucial for critical dimension and patterned feature evaluation. Therefore, in this work, we present a new sample preparation method for high performance cross-sectional secondary electron (SE) imaging, targeting features at the deep nanoscale and into the sub-10 nm regime.
View Article and Find Full Text PDFNew photoresists are needed to advance extreme ultraviolet (EUV) lithography. The tailored design of efficient photoresists is enabled by a fundamental understanding of EUV induced chemistry. Processes that occur in the resist film after absorption of an EUV photon are discussed, and a new approach to study these processes on a fundamental level is described.
View Article and Find Full Text PDFThe next generation of hard disk drive technology for data storage densities beyond 5 Tb/in will require single-bit patterning of features with sub-10 nm dimensions by nanoimprint lithography. To address this challenge master templates are fabricated using pattern multiplication with atomic layer deposition (ALD). Sub-10 nm lithography requires a solid understanding of materials and their interactions.
View Article and Find Full Text PDFPhonons can display both wave-like and particle-like behaviour during thermal transport. While thermal transport in silicon nanomeshes has been previously interpreted by phonon wave effects due to interference with periodic structures, as well as phonon particle effects including backscattering, the dominant mechanism responsible for thermal conductivity reductions below classical predictions still remains unclear. Here we isolate the wave-related coherence effects by comparing periodic and aperiodic nanomeshes, and quantify the backscattering effect by comparing variable-pitch nanomeshes.
View Article and Find Full Text PDFFree-electron lasers (FELs) currently represent a step forward on time-resolved investigations on any phase of matter through pump-probe methods involving FELs and laser beams. That class of experiments requires an accurate spatial and temporal superposition of pump and probe beams on the sample, which at present is still a critical procedure. More efficient approaches are demanded to quickly achieve the superposition and synchronization of the beams.
View Article and Find Full Text PDFPatterned chromium and its compounds are crucial materials for nanoscale patterning and chromium based devices. Here we investigate how temperature can be used to control chromium etching using chlorine/oxygen gas mixtures. Oxygen/chlorine ratios between 0% and 100% and temperatures between -100 °C and +40 °C are studied.
View Article and Find Full Text PDFExtreme ultraviolet lithography (EUVL) is the leading technology for enabling miniaturization of computational components over the next decade. Next-generation resists will need to meet demanding performance criteria of 10 nm critical dimension, 1.2 nm line-edge roughness, and 20 mJ cm(-2) exposure dose.
View Article and Find Full Text PDFComplex materials are defined as nanostructured materials with combinations of structure and/or composition that lead to performance surpassing the sum of their individual components. There are many methods that can create complex materials; however, atomic layer deposition (ALD) is uniquely suited to control composition and structural parameters at the atomic level. The use of ALD for creating complex insulators, semiconductors, and conductors is discussed, along with its use in novel structural applications.
View Article and Find Full Text PDFHere we present a new resist design concept. By adding dilute cross-linkers to a chemically amplified molecular resist, we synergize entropic and enthalpic contributions to dissolution by harnessing both changes to molecular weight and changes in intermolecular bonding to create a system that outperforms resists that emphasize one contribution over the other. We study patterning performance, resist modulus, solubility kinetics and material redistribution as a function of cross-linker concentration.
View Article and Find Full Text PDFThe combination of block copolymer (BCP) lithography and plasma etching offers a gateway to densely packed sub-10 nm features for advanced nanotechnology. Despite the advances in BCP lithography, plasma pattern transfer remains a major challenge. We use controlled and low substrate temperatures during plasma etching of a chromium hard mask and then the underlying substrate as a route to high aspect ratio sub-10 nm silicon features derived from BCP lithography.
View Article and Find Full Text PDFA novel and robust route for high-throughput, high-performance nanophotonics-based direct imprint of high refractive index and low visible wavelength absorption materials is presented. Sub-10 nm TiO2 nanostructures are fabricated by low-pressure UV-imprinting of an organic-inorganic resist material. Post-imprint thermal annealing allows optical property tuning over a wide range of values.
View Article and Find Full Text PDFPlasma etching is a powerful technique for transferring high-resolution lithographic masks into functional materials. Significant challenges arise with shrinking feature sizes, such as etching with thin masks. Traditionally this has been addressed with hard masks and consequently additional costly steps.
View Article and Find Full Text PDFHigh-aspect-ratio sub-15-nm silicon trenches are fabricated directly from plasma etching of a block copolymer mask. A novel method that combines a block copolymer reconstruction process and reactive ion etching is used to make the polymer mask. Silicon trenches are characterized by various methods and used as a master for subsequent imprinting of different materials.
View Article and Find Full Text PDFDirected self-assembly (DSA) of block copolymers (BCPs), either by selective wetting of surface chemical prepatterns or by graphoepitaxial alignment with surface topography, has ushered in a new era for high-resolution nanopatterning. These pioneering approaches, while effective, require expensive and time-consuming lithographic patterning of each substrate to direct the assembly. To overcome this shortcoming, nanoimprint molds--attainable via low-cost optical lithography--were investigated for their potential to be reusable and efficiently template the assembly of block copolymers (BCPs) while under complete confinement.
View Article and Find Full Text PDFBlock copolymer (BCP) lithography is a powerful technique to write periodic arrays of nanoscale features into substrates at exceptionally high densities. In order to place these features at will on substrates, nanoimprint offers a deceptively clear path toward high throughput production: nanoimprint molds are reusable, promote graphoepitaxial alignment of BCP microdomains within their topography, and are efficiently aligned with respect to the substrate using interferometry. Unfortunately, when thin films of BCPs are subjected to thermal nanoimprint, there is an overwhelming degree of adhesion at the mold-polymer interface, which compromises the entire process.
View Article and Find Full Text PDFWe fabricated hexagonal graphene nanomeshes (GNMs) with sub-10 nm ribbon width. The fabrication combines nanoimprint lithography, block-copolymer self-assembly for high-resolution nanoimprint template patterning, and electrostatic printing of graphene. Graphene field-effect transistors (GFETs) made from GNMs exhibit very different electronic characteristics in comparison with unpatterned GFETs even at room temperature.
View Article and Find Full Text PDFWe present a systematic study on the thermal nanoimprinting of a boron subphthalocynamine molecule, 2-allylphenoxy-(subphthalocyaninato)boron(III) (SubPc-A), which represents a class of attractive small-molecular weight organic compounds for organic-based photovoltaics (OPV). The final equilibrium imprinted feature profile strongly depends on the imprinting temperature. The highest feature aspect ratio (or contrast) occurs at a specific window of imprinting temperatures (80-90 degrees C).
View Article and Find Full Text PDFWe present a novel fabrication method for incorporating nanometer to micrometer scale few-layer graphene (FLG) features onto substrates with electrostatic exfoliation. We pattern highly oriented pyrolytic graphite using standard lithographic techniques and subsequently, in a single step, exfoliate and transfer-print the prepatterned FLG features onto a silicon wafer using electrostatic force. We have successfully demonstrated the exfoliation/printing of 18 nm wide FLG nanolines and periodic arrays of 1.
View Article and Find Full Text PDFResist detachment from the substrate during mold-substrate separation is one of the key challenges for nanoimprint lithography as the pitch of features decreases. We analyzed the problem by considering the surface and interfacial free energies of the initial state and the possible final states of the mold-polymer-substrate system and designed the chemistry of the system to provide the desired final state. We dramatically improved the resist adhesion to the substrate by assembling a monolayer of surface linker molecules on the substrate surface.
View Article and Find Full Text PDFThis letter reports the demonstration of a photocurable polymer process for replicating the master mold for nanoimprint lithography. The cross-linked polymer mold was fabricated directly with high fidelity from a master by imprinting and photocuring a low viscosity liquid prepolymer film spun onto a substrate. The surface of the cross-linked polymer mold can be treated using an O(2) plasma, and then vapor primed with a low surface energy mold release layer for repeatable imprinting.
View Article and Find Full Text PDFResist adhesion to the mold is one of the challenges for nanoimprint lithography. The main approach to overcoming it is to apply a self-assembled monolayer of an organosilane release agent to the mold surface, either in the solution phase or vapor phase. We compared the atomic force microscopy, ellipsometry, reflection-absorption infrared spectroscopy, and contact angle results collected from substrates treated by two different application processes and found that the vapor-phase process was superior.
View Article and Find Full Text PDFA spatial resolution of 20 nm is demonstrated at 2.07-nm wavelength by use of a soft x-ray microscope based on Fresnel zone plate lenses and partially coherent illumination. Nanostructural test patterns, formed by sputtered multilayer coatings and transmission electron microscopy thinning techniques, provide clear experimental results.
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