High-speed digital microsystems has emerged as one of the most important solutions for improving system performance, bandwidth, and power consumption. Based on mature micro-system processing technology, a material extraction approach for silicon interposer applied for high-speed digital microsystems was presented in order to obtain frequency-dependent precise material parameters. By combining microwave theory and mathematical model of iterative algorithm, the dielectric constant (Dk) and the dissipation factor (Df) of polyimide dielectric layer is acquired, which minimizes testing costs and streamlines testing process.
View Article and Find Full Text PDF