Effects of ZrO Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical Study.

This study investigates the mechanism and effects of incorporating different ZrO nano-particles into SAC0307 solder alloys. ZrO nano-powder and nano-fibers in 0.25-0.

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation.

This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs with a very fine pitch between leads. A novel approach was developed to measure the collapse of BGA solder balls during the melting and solidification process, enabling in situ measurements.

Personal Air-Quality Monitoring with Sensor-Based Wireless Internet-of-Things Electronics Embedded in Protective Face Masks.

In this paper, the design and research of a sensor-based personal air-quality monitoring device are presented, which is retrofitted into different personal protective face masks. Due to its small size and low power consumption, the device can be integrated into and applied in practical urban usage. We present our research and the development of the sensor node based on a BME680-type environmental sensor cluster with a wireless IoT (Internet of Things)-capable central unit and overall low power consumption.

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints.

Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment.

Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing Process.

This work presented an FEM (finite element method) mathematical model that describes the temperature distribution in different parts of a 3D printer based on additive manufacturing process using filament extrusion during its operation. Variation in properties also originate from inconsistent choices of process parameters employed by individual manufacturers. Therefore, a mathematical model that calculates temperature changes in the filament (and the resulting print) during an FFF (fused filament fabrication) process was deemed useful, as it can estimate otherwise immeasurable properties (such as the internal temperature of the filament during the printing).

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb.

The effect of recrystallization of 99.3Sn-0.7Cu wt.

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films.

The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room conditions for 60 days.

Measurement of doping profiles by a contactless method of IR reflectance under grazing incidence.

An improved contactless method of the measurement and evaluation of charge carrier profiles in polished wafers by infrared reflectance was developed. The sensitivity of optical reflectance to the incidence angle was theoretically analyzed. A grazing incident angle enhances sensitivity to doping profile parameters.