Tin, Bismuth, and Tin-Bismuth Alloy Electrodeposition from Chlorometalate Salts in Deep Eutectic Solvents.

The electrodeposition of tin, bismuth, and tin-bismuth alloys from Sn and Bi chlorometalate salts in the choline chloride/ethylene glycol (1:2 molar ratio) deep eutectic solvent was studied on glassy carbon and gold by cyclic voltammetry, rotating disc voltammetry, and chronoamperometry. The Sn-containing electrolyte showed one voltammetric redox process corresponding to Sn/Sn. The diffusion coefficient of [SnCl], detected as the dominating species by Raman spectroscopy, was determined from Levich and Cottrell analyses.