Unlabelled: A hatching-distance-controlled lattice of 65.1Co28.2Cr5.
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January 2022
Additive manufacturing (AM) is one of the pillars of Industry 4.0 to attain a circular economy. The process involves a layer-by-layer deposition of material from a computer-aided-design (CAD) model to form complex shapes.
View Article and Find Full Text PDFIn this work, the microstructure and mechanical properties of an additively manufactured X3NiCoMoTi18-9-5 maraging steel were determined. Optical and electron microscopies revealed the formation of melt pool boundaries and epitaxial grain growth with cellular dendritic structures after the laser powder bed fusion (LPBF) process. The cooling rate is estimated to be around 10 °C/s during solidification, which eliminates the nucleation of any precipitates.
View Article and Find Full Text PDFA novel In-Sn-Bi solder with a low electrical resistivity of 14.3 × 10 Ω cm and a melting temperature of 99.3 °C was produced for use in adhesive joining on a flexible poly(ethylene terephthalate) substrate.
View Article and Find Full Text PDFA modular solder system with hierarchical morphology and micro/nanofeatures in which solder nanoparticles are distributed on the surface of template micropowders is reported. A core-shell structure of subsidiary nanostructures, which improved the intended properties of the modular solder is also presented. In addition, polymer additives can be used not only as an adhesive (like epoxy resin) but also to impart other functions.
View Article and Find Full Text PDFHexagonal boron nitride-reinforced Inconel 718 (h-BN/IN718) composites were fabricated using a laser powder bed fusion (LPBF) technique to treat a nanosheet-micropowder precursor mixture prepared in a mechanical blending process. Tailoring the BN in IN718 enhanced the thermal resistance of the composites, thereby dampening the sharpness of the melting temperature peak at 1364 °C. This is because the presence of the BN reinforcement, which has a low coefficient of thermal expansion (CTE), resulted in a heat-blocking effect within the matrix.
View Article and Find Full Text PDFMulti-walled carbon nanotube (MWCNT)/indium-tin-bismuth (In-Sn-Bi) composite nanostructures in which In-Sn-Bi nanoparticles have been penetrated by the MWCNT arrays were synthesized using a chemical reduction method. The incorporation of 0.6 wt% MWCNTs with high electrical conductivity into the In-based solder resulted in low minimum electrical resistivity (19.
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