Wafer-Scale Fabrication of Ultra-High Aspect Ratio, Microscale Silicon Structures with Smooth Sidewalls Using Metal Assisted Chemical Etching.

Silicon structures with ultra-high aspect ratios have great potential applications in the fields of optoelectronics and biomedicine. However, the slope and increased roughness of the sidewalls inevitably introduced during the use of conventional etching processes (e.g.

Facile and stable fabrication of wafer-scale, ultra-black -silicon with 3D nano/micro hybrid structures for solar cells.

Three-dimensional (3D) silicon (Si) nanostructures have attracted much attention in solar cells due to their excellent broadband and omnidirectional light-harvesting properties. However, the development of 3D Si nanostructures is still plagued by the trade-off between structural complexity and fabrication difficulty. Herein, we proposed a facile and stable approach toward the fabrication of wafer-scale, ultra-black crystalline silicon (c-Si) with nano/micro hybrid structures.