Design Strategy for Transformative Electronic System toward Rapid, Bidirectional Stiffness Tuning using Graphene and Flexible Thermoelectric Device Interfaces.

Electronics with tunable shape and stiffness can be applied in broad range of applications because their tunability allows their use in either rigid handheld form or soft wearable form, depending on needs. Previous research has enabled such reconfigurable electronics by integrating a thermally tunable gallium-based platform with flexible/stretchable electronics. However, supercooling phenomenon caused in the freezing process of gallium impedes reliable and rapid bidirectional rigid-soft conversion, limiting the full potential of this type of "transformative" electronics.

Variable Rigidity Module with a Flexible Thermoelectric Device for Bidirectional Temperature Control.

Dynamic stiffness tuning is a promising approach for shape reconfigurable systems that must adapt their flexibility in response to changing operational requirements. Among stiffness tuning technologies, phase change materials are particularly promising because they are size scalable and can be powered using portable electronics. However, the long transition time required for phase change is a great limitation for most applications.

Thermal display glove for interacting with virtual reality.

Thermal perception is essential for the survival and daily activities of people. Thus, it is desirable to realize thermal feedback stimulation for improving the sense of realism in virtual reality (VR) for users. For thermal stimulus, conventional systems utilize liquid circulation with bulky external sources or thermoelectric devices (TEDs) on rigid structures.

Two-Dimensional Thermal Haptic Module Based on a Flexible Thermoelectric Device.

In this study, we introduce a haptic communication method using two-dimensional (2D) arrayed thermal haptic module. The 2D thermal haptic module delivers real-time information to user through the thermoception of the user's skin. Such 2D thermal haptic module could be realized using flexible thermoelectric (TE) device and independent temperature control of individual unit cell that are arranged in the form of 2D array.

A High-Performance Top-Gated Graphene Field-Effect Transistor with Excellent Flexibility Enabled by an iCVD Copolymer Gate Dielectric.

A high-performance top-gated graphene field-effect transistor (FET) with excellent mechanical flexibility is demonstrated by implementing a surface-energy-engineered copolymer gate dielectric via a solvent-free process called initiated chemical vapor deposition. The ultrathin, flexible copolymer dielectric is synthesized from two monomers composed of 1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane and 1-vinylimidazole (VIDZ). The copolymer dielectric enables the graphene device to exhibit excellent dielectric performance and substantially enhanced mechanical flexibility.

A facility to search for hidden particles at the CERN SPS: the SHiP physics case.

This paper describes the physics case for a new fixed target facility at CERN SPS. The SHiP (search for hidden particles) experiment is intended to hunt for new physics in the largely unexplored domain of very weakly interacting particles with masses below the Fermi scale, inaccessible to the LHC experiments, and to study tau neutrino physics. The same proton beam setup can be used later to look for decays of tau-leptons with lepton flavour number non-conservation, [Formula: see text] and to search for weakly-interacting sub-GeV dark matter candidates.

Application of N-Doped Three-Dimensional Reduced Graphene Oxide Aerogel to Thin Film Loudspeaker.

We built a thermoacoustic loudspeaker employing N-doped three-dimensional reduced graphene oxide aerogel (N-rGOA) based on a simple template-free fabrication method. A two-step fabrication process, which includes freeze-drying and reduction/doping, was used to realize a three-dimensional, freestanding, and porous graphene-based loudspeaker, whose macroscopic structure can be easily modulated. The simplified fabrication process also allows the control of structural properties of the N-rGOAs, including density and area.

Hybrid Integration of Graphene Analog and Silicon Complementary Metal-Oxide-Semiconductor Digital Circuits.

We demonstrate a hybrid integration of a graphene-based analog circuit and a silicon-based digital circuit in order to exploit the strengths of both graphene and silicon devices. This mixed signal circuit integration was achieved using a three-dimensional (3-D) integration technique where a graphene FET multimode phase shifter is fabricated on top of a silicon complementary metal-oxide-semiconductor field-effect transistor (CMOS FET) ring oscillator. The process integration scheme presented here is compatible with the conventional silicon CMOS process, and thus the graphene circuit can successfully be integrated on current semiconductor technology platforms for various applications.

Free-Standing Graphene Thermophone on a Polymer-Mesh Substrate.

A graphene thermoacoustic loudspeaker with a thin polymer mesh is fabricated using screen-printing. An experiment with substrates of various free-standing areas shows that a higher sound pressure level can be achieved as compared to previously reported graphene thermoacoustic loudspeakers. Moreover, a modified equation to predict the sound pressure level of the thermoacoustic loudspeaker with a thin and patterned substrate is proposed and verified by experimental results.