Gradient-Pattern Micro-Grooved Wicks Fabricated by the Ultraviolet Nanosecond Laser Method and Their Enhanced Capillary Performance.

Capillary-gradient wicks can achieve fast or directional liquid transport, but they face fabrication challenges by traditional methods in terms of precise patterns. Laser processing is a potential solution due to its high pattern accuracy, but there are a few studies on laser-processed capillary-gradient wicks. In this paper, capillary step-gradient micro-grooved wicks (CSMWs) were fabricated by an ultraviolet nanosecond pulsed laser, and their capillary performance was studied experimentally.

Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties.

In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole, 2-phenylimidazole, and benzimidazole) that serve as protective and dispersing agents. Through a complexation reaction between Cu atoms, the imidazole compounds can form a protective film on the Cu nanoparticles to prevent the particles from rapidly oxidizing. We compared the effects of the four kinds of imidazole compounds on the oxidation resistance and sintering properties of Cu particles.

Research Status of Manufacturing Technology of Tungsten Alloy Wire.

In light of the fact that tungsten wire is gradually replacing high-carbon steel wire as a diamond cutting line, it is particularly important to study tungsten alloy wire with better strength and performance. According to this paper, in addition to various technological factors (powder preparation, press forming, sintering, rolling, rotary forging, annealing, wire drawing, etc.), the main factors affecting the properties of the tungsten alloy wire are the composition of the tungsten alloy, the shape and size of the powder, etc.

Improved Anti-Vulcanization and Bonding Performance of a Silver Alloy Bonding Wire by a Cathodic Passivation Treatment with Palladium.

As a traditional interconnect material, silver alloy bonding wires are widely used in electronic packaging, but their propensity to vulcanize quickly has not been sufficiently addressed. The current surface anti-oxidation and anti-sulfidation treatments are often accompanied by a decline in bonding performance, which hinders the use of silver alloy bonding wires in new applications. In the present paper, we develop a new cathodic passivation treatment in a Pd-containing solution for silver bonding wires, which not only significantly improves their vulcanization resistance, but also maintains their bonding performance.

A Green and Facile Microvia Filling Method via Printing and Sintering of Cu-Ag Core-Shell Nano-Microparticles.

In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with L-His complexing agent, Cu@Ag NMPs with compact and uniform Ag shells, excellent sphericity and oxidation resistance were synthesized. The as-synthesized Cu@Ag NMPs show superior microvia filling properties to Cu nanoparticles (NPs), Ag NPs, and Cu NMPs.

High Thermoelectric Performance Achieved in Sb-Doped GeTe by Manipulating Carrier Concentration and Nanoscale Twin Grains.

Lead-free and eco-friendly GeTe shows promising mid-temperature thermoelectric applications. However, a low Seebeck coefficient due to its intrinsically high hole concentration induced by Ge vacancies, and a relatively high thermal conductivity result in inferior thermoelectric performance in pristine GeTe. Extrinsic dopants such as Sb, Bi, and Y could play a crucial role in regulating the hole concentration of GeTe because of their different valence states as cations and high solubility in GeTe.

Green synthesis of novelmicro/submicron-Cu paste for semiconductor interconnection.

A green method for the synthesis ofCu paste is developed. Cu particles are prepared through chemical reduction by selecting a special copper source, reducing agent, and solvent. Then the reaction solution is directly concentrated to obtain anCu paste.

A quantitative model to understand the microflow-controlled sintering mechanism of metal particles at nanometer to micron scale.

In this paper, the particle size effect on the sintering behaviors of Cu particles at nanometer to micron scale is explored. The results show that micron-sized particles could form obvious sintering necks at a low temperature of 260 °C, exhibiting a shear strength as high as 64 MPa. A power relation of ∝ between sintering neck radius () and particle radius () is discovered, and a sintering model with a quantitative relational expression of (/) = 160/3is proposed by considering the surface tension driven microflow process between adjacent particles to predict the growth of sintering necks.

Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire.

The performance of Ag-8.5Au-3.5Pd alloy wire after cold deformation and annealing were analyzed by SEM (scanning electron microscope), strength tester and resistivity tester.

Understanding the relationship between particle size and ultrasonic treatment during the synthesis of metal nanoparticles.

Ultrasonic treatment is an effective method for size refinement and dispersion of nanomaterials during their synthesis process. However, the quantitative relationship between ultrasonic conditions and particle size in the synthesis of metal nanoparticles has not been fully revealed. In this study, Cu nanoparticles were synthesized via the wet-chemical redox method under ultrasonic treatment, and statistical analysis on the evolution of particle size distribution was carried out.

PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu-Ag Nanoflakes for Electrically Conductive Pastes.

Elliptic Cu-Ag nanoflakes were syntheszied via facile in situ galvanic replacement between prepared Cu particles and Ag ions. Alloy nanoflakes with high purity and uniformity present a size of 700 × 500 nm, with a thinness of 30 nm. Nontoxic and low-cost polyvinyl pyrrolidone was used as a dispersant and structure-directing agent, promoting the formation of the remarkable structure.