Dense Packed Drivable Optrode Array for Precise Optical Stimulation and Neural Recording in Multiple-Brain Regions.

The input-output function of neural networks is complicated due to the huge number of neurons and synapses, and some high-density implantable electrophysiology recording tools with a plane structure have been developed for neural circuit studies in recent years. However, traditional plane probes are limited by the record-only function and inability to monitor multiple-brain regions simultaneously, and the complete cognition of neural networks still has a long way away. Herein, we develop a three-dimensional (3D) high-density drivable optrode array for multiple-brain recording and precise optical stimulation simultaneously.

An artefact-resist optrode with internal shielding structure for low-noise neural modulation.

Objective: The combination of optical manipulation of neural activities with electrophysiology recording is a promising technology for discovering mechanisms of brain disorders and mapping brain networks. However, fiber-based optrode is limited by the large size of light source and the winding of optical fiber, which hinders animal's natural movement. Meanwhile, the laser diode (LD)-based optrode restricted to the stimulation-locked artefacts will contaminate neural signal acquired from recording channels.

Flexible and stretchable opto-electric neural interface for low-noise electrocorticogram recordings and neuromodulation in vivo.

Optogenetic-based neuromodulation tools is evolving for the basic neuroscience research in animals combining optical manipulation and electrophysiological recordings. However, current opto-electric integrated devices attaching on cerebral cortex for electrocorticogram (ECoG) still exist potential damage risks for both brain tissue and electrode, due to the mechanical mismatch and brain deformation. Here, we propose a stretchable opto-electric integrated neural interface by integrating serpentine-shaped electrodes and multisite micro-LEDs onto a hyperelastic substrate, as well as a serpentine-shaped metal shielding embedded in recording electrode for low-noise signal acquisition.

The use of a double-layer platinum black-conducting polymer coating for improvement of neural recording and mitigation of photoelectric artifact.

The impedance of electrode and photostimulation artifacts (short-duration and high-amplitude spikes) are still hindering the employment of silicon-based neural probe in optogenetics. A fiber-based optrode modified with a double-layer platinum black-poly (3,4ethylenedioxythiophene) PEDOT/poly (4-styrenesulfonate) PSS (Pt-PP) coating has been developed for improvement of neural recording quality and mitigation of photoelectric artifact simultaneously. The Pt-PP coating was made by layer-by-layer electrochemical deposition followed by the ultrasonication and Cyclic Voltammetry (CV) scanning to verify its mechanical and electrochemical stability.

Active information maintenance in working memory by a sensory cortex.

Working memory is a critical brain function for maintaining and manipulating information over delay periods of seconds. It is debated whether delay-period neural activity in sensory regions is important for the active maintenance of information during the delay period. Here, we tackle this question by examining the anterior piriform cortex (APC), an olfactory sensory cortex, in head-fixed mice performing several olfactory working memory tasks.

Flexible bioelectrodes with enhanced wrinkle microstructures for reliable electrochemical modification and neuromodulation in vivo.

Limited electrode size with high electrochemical performance and reliability of modified materials are two of the main concerns for flexible neural electrodes in recent years. Here, an effective fabrication method of enhanced micro-scale wrinkles based on oil-pretreated hyperelastic substrates (PDMS and Ecoflex) is proposed for the application of microelectrode biosensors. Compared to pre-stretching or compressing methods, this approach has better advantages including compatibility with MEMS processes on wafer and easy replication.