Publications by authors named "Chansu Jeon"
Ru Passivation Layer Enables Cu-Cu Direct Bonding at Low Temperatures with Oxidation Inhibition.
ACS Appl Mater Interfaces
September 2024
Article Synopsis
- Stacking semiconductor chips enhances packing density and efficiency, leading to better performance, speed, and lower power usage.
- Traditional Cu to Cu direct bonding (CCDB) requires high temperatures above 250 °C to prevent oxidation, which limits its practical applications.
- A new method using a 6 nm Ru layer allows for reliable bonding at temperatures as low as 200 °C, achieving strong connections and stability in extreme temperature cycles.