Publications by authors named "Chang-Hsiang Hung"
Article Synopsis
- X-ray nanodiffraction was utilized to analyze thermal stress in 10 µm nanotwinned copper bumps within Cu/SiO hybrid structures across various temperatures from -55 °C to 200 °C.
- The study found that the Cu bumps experienced compressive thermal stress both before and after hybrid bonding, with an average stress value reaching -169.1 MPa at 200 °C.
- This research offers insights into the strain and stress behaviors of confined metal bumps and enhances understanding of hybrid bonding processes that do not require external compression.
We adopted (111)-oriented Cu with high surface diffusivity to achieve low-temperature and low-pressure Cu/SiO hybrid bonding. Electroplating was employed to fabricate arrays of Cu vias with 78% (111) surface grains. The bonding temperature can be lowered to 200 °C, and the pressure is as low as 1.
View Article and Find Full Text PDFIn this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization.
View Article and Find Full Text PDFChitosan, a biocompatible material that has been widely used in bone tissue engineering, is believed to have a high affinity to osteoblastic cells. This research is the first to prove this hypothesis. By using atomic force microscopy (AFM) with a chitosan-modified cantilever, quantitative evaluation of the interforce between chitosan and cells was carried out.
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