Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration.

As the power electronics landscape evolves, pushing for greater vertical integration, capillary underfilling is considered a versatile encapsulation technique suited for iterative development cycles of innovative integration concepts. Since a defect-free application is critical, this study proposes a capillary two-phase flow simulation, predicting both the flow pattern and velocity with remarkable precision and efficiency. In a preliminary performance evaluation, Volume of Fluid (VOF) outperforms the Level-Set method in terms of accuracy and computation time.