The utilisation of non- yeasts in co-inoculation and non-thermal technologies for must sterilisation is becoming increasingly prevalent due to their notable utility and potential. This new approach optimises the fermentation process and contributes to facilitating the production of wines with distinctive characteristics, improving their stability, and without organoleptic repercussions. Two trials were conducted concurrently, designated as A and B, using the same Tempranillo red must.
View Article and Find Full Text PDFSpins of electrons in silicon MOS quantum dots combine exquisite quantum properties and scalable fabrication. In the age of quantum technology, however, the metrics that crowned Si/SiO as the microelectronics standard need to be reassessed with respect to their impact upon qubit performance. We chart spin qubit variability due to the unavoidable atomic-scale roughness of the Si/SiO interface, compiling experiments across 12 devices, and develop theoretical tools to analyse these results.
View Article and Find Full Text PDFThe encoding of qubits in semiconductor spin carriers has been recognized as a promising approach to a commercial quantum computer that can be lithographically produced and integrated at scale. However, the operation of the large number of qubits required for advantageous quantum applications will produce a thermal load exceeding the available cooling power of cryostats at millikelvin temperatures. As the scale-up accelerates, it becomes imperative to establish fault-tolerant operation above 1 K, at which the cooling power is orders of magnitude higher.
View Article and Find Full Text PDFThe small size and excellent integrability of silicon metal-oxide-semiconductor (SiMOS) quantum dot spin qubits make them an attractive system for mass-manufacturable, scaled-up quantum processors. Furthermore, classical control electronics can be integrated on-chip, in-between the qubits, if an architecture with sparse arrays of qubits is chosen. In such an architecture qubits are either transported across the chip via shuttling or coupled via mediating quantum systems over short-to-intermediate distances.
View Article and Find Full Text PDF