Publications by authors named "Byoung O Kim"

Copper metallization is a key issue for high performance thin film transistor technology. Hydrogen peroxide-based copper etchants are widely used in copper metallization. Recently, a hydrogen peroxide-based copper etchant for a copper/molybdenum double layer was investigated for its versatile use in both amorphous silicon TFTs and in metal-oxide TFTs.

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NiCr, Mo, and Mo-N thin copper diffusion barrier films are deposited on 200 um thick polyimide films spin-coated on glass substrates by dc reactive magnetron sputtering. The adhesion forces for three systems are measured by micro-scratch test analysis depending on oxygen plasma pretreatment, sputtering power density, moisture contents, and post annealing treatment. The values of adhesion forces for the three systems are linearly proportional to the oxygen plasma treatment time.

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The dissolution mechanisms of Cu thin film were studied with a focus on the effect of chlorine ion concentrations in mixture solutions of phosphoric and nitric acid. The dissolution behaviors of Cu thin film were investigated by using potentio-dynamic curves and impedance spectroscopy with varying chlorine ion concentrations. The copper dissolution rate decreased and as a result of this change, CuCl, salt films formed on the Cu surface in the presence of chlorine ions in the mixture solution.

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Molybdenum-tantalum alloy thin film is a suitable material for the higher corrosion resistance and low resistivity for gate and data metal lines. In this study, Mo-Ta alloy thin films were prepared by using a DC magnetron co-sputtering system on a glass substrate. An abrupt increase in the etching rates of low Mo-Ta alloys was observed.

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Objective: To compare infection control (IC) knowledge, attitudes and practice of dentists across eight countries.

Methods: Self-administered infection control surveys were completed by 1,874 clinicians in eight countries. Practitioner's knowledge, attitudes, and practice of infection control were examined using over 100 variables.

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