MEMS within a Swagelok: a new platform for microfluidic devices.

A novel packaging cum interfacing technique for microfluidic devices is reported. Unlike the conventional approach towards packaging in which the microsystem is first developed and finally packaged, a reverse approach is shown here that integrates the package with the microsystem either at the beginning or within the fabrication process. This new method employs standard glass tubes as substrates on which microfluidic components are fabricated.