Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials.

The swift progression of high-density chiplet packaging, propelled by the artificial intelligence revolution, has precipitated a critical need for high-performance chip-scale thermal interface materials (TIMs). The elevated thermal resistance, limited interfacial adhesion, and mechanical flexibility intrinsic to silicone systems present a substantial challenge in meeting reliability standards amidst chip warpage. This particular matter underscores a significant performance bottleneck within existing high-end TIMs.