This paper addresses the challenging issue of achieving high spatial resolution in temperature monitoring of printed circuit boards (PCBs) without compromising the operation of electronic components. Traditional methods involving numerous dedicated sensors such as thermocouples are often intrusive and can impact electronic functionality. To overcome this, this study explores the application of ultrasonic guided waves, specifically utilising a limited number of cost-effective and unobtrusive Piezoelectric Wafer Active Sensors (PWAS).
View Article and Find Full Text PDFThe computer modelling of condition monitoring sensors can aide in their development, improve their performance, and allow for the analysis of sensor impact on component operation. This article details the development of a COMSOL model for a guided wave-based temperature monitoring system, with a view to using the technology in the future for the temperature monitoring of nozzle guide vanes, found in the hot section of aeroengines. The model is based on an experimental test system that acts as a method of validation for the model.
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