This study investigates the fabrication process of copper thin films via thermal evaporation, with precise control over film thickness achieved through-position adjustment. Analysis of the as-fabricated copper films reveals a discernible relationship between grain size (〈〉) and-position, characterized by a phenomenological equation〈D〉XRDn(Z)=〈D〉0n1+32rZ2+158rZ4, which is further supported by a growth exponent () of 0.41 obtained from the analysis.
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