Strain engineered SiGe multiple-quantum-well nanomembranes for far-infrared intersubband device applications.

SiGe/Si quantum wells are of great interest for the development of Group-IV THz quantum cascade lasers. The main advantage of Group-IV over III-V materials such as GaAs is that, in the former, polar phonon scattering, which significantly diminishes the efficiency of intersubband light emission, is absent. However, for SiGe/Si multiple-quantum-well structures grown on bulk Si, the lattice mismatch between Si and Ge limits the critical thickness for dislocation formation and thus the number of periods that can be grown.

Fabrication of ultrahigh-density nanowires by electrochemical nanolithography.

An approach has been developed to produce silver nanoparticles (AgNPs) rapidly on semiconductor wafers using electrochemical deposition. The closely packed AgNPs have a density of up to 1.4 × 1011 cm-2 with good size uniformity.

Influence of surface properties on the electrical conductivity of silicon nanomembranes.

Because of the large surface-to-volume ratio, the conductivity of semiconductor nanostructures is very sensitive to surface chemical and structural conditions. Two surface modifications, vacuum hydrogenation (VH) and hydrofluoric acid (HF) cleaning, of silicon nanomembranes (SiNMs) that nominally have the same effect, the hydrogen termination of the surface, are compared. The sheet resistance of the SiNMs, measured by the van der Pauw method, shows that HF etching produces at least an order of magnitude larger drop in sheet resistance than that caused by VH treatment, relative to the very high sheet resistance of samples terminated with native oxide.

Si/Ge junctions formed by nanomembrane bonding.

We demonstrate the feasibility of fabricating heterojunctions of semiconductors with high mismatches in lattice constant and coefficient of thermal expansion by employing nanomembrane bonding. We investigate the structure of and electrical transport across the interface of a Si/Ge bilayer formed by direct, low-temperature hydrophobic bonding of a 200 nm thick monocrystalline Si(001) membrane to a bulk Ge(001) wafer. The membrane bond has an extremely high quality, with an interfacial region of ∼1 nm.

Influence of surface chemical modification on charge transport properties in ultrathin silicon membranes.

Ultrathin silicon-on-insulator, composed of a crystalline sheet of silicon bounded by native oxide and a buried oxide layer, is extremely resistive because of charge trapping at the interfaces between the sheet of silicon and the oxide. After chemical modification of the top surface with hydrofluoric acid (HF), the sheet resistance drops to values below what is expected based on bulk doping alone. We explain this behavior in terms of surface-induced band structure changes combined with the effective isolation from bulk properties created by crystal thinness.