The most recent breakthrough in state-of-the-art electronics and optoelectronics involves the adoption of steep-slope field-effect transistors (FETs), promoting sub-60 mV/dec subthreshold swing (SS) at ambient temperature, effectively overcoming "Boltzmann limit" to minimize power consumption. Here, a series integration of nanoscale copper-based resistive-filamentary threshold switch (TS) with the IGZO channel-based FET is used to develop a TS-FET, in which the turn-on characteristics exhibit an abrupt transition over five decades, with an extremely low SS of 7 mV/dec, a high on/off ratio (>10), and ultralow leakage current (40-fold decrease), ensuring excellent repeatability and device yield. Unlike previous device-centric studies, this work highlights potential circuit applications (logic-inverter, pulse-sensor amplification, and photodetector) based on TS-FET.
View Article and Find Full Text PDFThe development of data-intensive computing methods imposes a significant load on the hardware, requiring progress toward a memory-centric paradigm. Within this context, ternary content-addressable memory (TCAM) can become an essential platform for high-speed in-memory matching applications of large data vectors. Compared to traditional static random-access memory (SRAM) designs, TCAM technology using non-volatile resistive memories (RRAMs) in two-transistor-two-resistor (2T2R) configurations presents a cost-efficient alternative.
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February 2021
Forming metal contact with low contact resistance is essential for the development of electronics based on layered van der Waals materials. ReS is a semiconducting transition metal dichalcogenide (TMD) with an MX structure similar to that of MoS. While most TMDs grow parallel to the substrate when synthesized using chemical vapor deposition (CVD), ReS tends to orient itself vertically during growth.
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November 2019
Resistive memristors are considered to be key components in the hardware implementation of complex neuromorphic networks because of their simplicity, compactness, and manageable power dissipation. However, breakthroughs with respect to both the selector material technology and the bit-cost-effective three-dimensional (3D) device architecture are necessary to provide sufficient device density while maintaining the advantages of a two-terminal device. Despite substantial progress in the scaling of the memristor devices, the scaling potential of the selector materials remains unclear.
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