Publications by authors named "Anjie Hu"

Based on the sludge mass transfer flux model, this paper conducts a simulation study on the drying characteristics of sludge under low-temperature environment and compares it with the previous experimental results. It is found that when the sludge moisture content is low, the change of its drying curve is basically consistent with the experimental results, but there is a large error when the sludge moisture content is 0.4-0.

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In this work, the freezing characteristics of double-droplet impact on three typical wettability surfaces were investigated by coupling the solidification and melting VOF models. Different temperature conditions were adopted to study the influence of icing speed on droplet behavior. Simulation results show that the motion of the double-droplet impact is consistent with that of a single droplet in the early spreading stage but behaves differently in the retraction stage.

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To improve thermal insulation, microencapsulated phase change materials (micro-PCMs), expandable graphite (EG), and ammonium polyphosphate (APP) were introduced into polyurethane foam (PUF) to enhance the thermal stability and improve the thermal insulation behavior. The morphology of the PUF and micro-PCM was studied using a scanning electronic microscope (SEM), while the thermophysical properties of the PUF were investigated using a hot disk thermal constants analyzer and differential scanning calorimetry (DSC). The thermal stability of the PUF was investigated by thermogravimetric analysis (TGA), and the gas products volatilized from the PUF were analyzed by thermogravimetric analysis coupled with Fourier transform infrared spectrometry (TGA-FTIR).

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The single component pseudopotential lattice Boltzmann model has been widely applied in multiphase simulation due to its simplicity and stability. In many studies, it has been claimed that this model can be stable for density ratios larger than 1000. However, the application of the model is still limited to small density ratios when the contact angle is considered.

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