High Seebeck Coefficient of Porous Silicon: Study of the Porosity Dependence.

In-plane Seebeck coefficient of porous Si free-standing membranes of different porosities was accurately measured at room temperature. Quasi-steady-state differential Seebeck coefficient method was used for the measurements. A detailed description of our home-built setup is presented.

Dielectric properties of porous silicon for use as a substrate for the on-chip integration of millimeter-wave devices in the frequency range 140 to 210 GHz.

Unlabelled: In this work, the dielectric properties of porous Si for its use as a local substrate material for the integration on the Si wafer of millimeter-wave devices were investigated in the frequency range 140 to 210 GHz. Broadband electrical characterization of coplanar waveguide transmission lines (CPW TLines), formed on the porous Si layer, was used in this respect. It was shown that the dielectric parameters of porous Si (dielectric permittivity and loss tangent) in the above frequency range have values similar to those obtained at lower frequencies (1 to 40 GHz).

Thermal conductivity of highly porous Si in the temperature range 4.2 to 20 K.

Unlabelled: We report on experimental results of the thermal conductivity k of highly porous Si in the temperature range 4.2 to 20 K, obtained using the direct current (dc) method combined with thermal finite element simulations. The reported results are the first in the literature for this temperature range.

Si nanowires by a single-step metal-assisted chemical etching process on lithographically defined areas: formation kinetics.

In this paper, we investigate the formation kinetics of Si nanowires [SiNWs] on lithographically defined areas using a single-step metal-assisted chemical etching process in an aqueous HF/AgNO3 solution. We show that the etch rate of Si, and consequently, the SiNW length, is much higher on the lithographically defined areas compared with that on the non-patterned areas. A comparative study of the etch rate in the two cases under the same experimental conditions showed that this effect is much more pronounced at the beginning of the etching process.