Simulation of synthetic gecko arrays shearing on rough surfaces.

To better understand the role of surface roughness and tip geometry in the adhesion of gecko synthetic adhesives, a model is developed that attempts to uncover the relationship between surface feature size and the adhesive terminal feature shape. This model is the first to predict the adhesive behaviour of a plurality of hairs acting in shear on simulated rough surfaces using analytically derived contact models. The models showed that the nanoscale geometry of the tip shape alters the macroscale adhesion of the array of fibres by nearly an order of magnitude, and that on sinusoidal surfaces with amplitudes much larger than the nanoscale features, spatula-shaped features can increase adhesive forces by 2.

Gecko toe and lamellar shear adhesion on macroscopic, engineered rough surfaces.

The role in adhesion of the toes and lamellae - intermediate-sized structures - found on the gecko foot remains unclear. Insight into the function of these structures can lead to a more general understanding of the hierarchical nature of the gecko adhesive system, but in particular how environmental topology may relate to gecko foot morphology. We sought to discern the mechanics of the toes and lamellae by examining gecko adhesion on controlled, macroscopically rough surfaces.

Dry self-cleaning properties of hard and soft fibrillar structures.

Recently, gecko-inspired synthetic adhesives (GSAs) have been made using a variety of fabrication techniques and materials, with one made from a hard polymer having been reported to recover its shear adhesion after fouling by normal use, or "dry self-clean", a feature useful for applications in wall crawling robots, reusable adhesives, microfabrication and solar panel cleaning. This paper investigates the impact of two design parameters on the dry self-cleaning capability of GSAs by experimentally testing two GSAs after fouling with small (1 μm), medium (3-10 μm), and large (40-50 μm) particles. We found that a GSA made from a hard thermoplastic with nanoscopic fibers was able to recover 96-115% of its shear adhesion after fouling with small and large but not medium particles, while a GSA made from a soft polymer and microscopic fibers recovered 40-55% on medium and large particles, with SEM imaging revealing particles embedding within the polymer.

Carbon nanotube active-matrix backplanes for conformal electronics and sensors.

In this paper, we report a promising approach for fabricating large-scale flexible and stretchable electronics using a semiconductor-enriched carbon nanotube solution. Uniform semiconducting nanotube networks with superb electrical properties (mobility of ∼20 cm2 V(-1) s(-1) and ION/IOFF of ∼10(4)) are obtained on polyimide substrates. The substrate is made stretchable by laser cutting a honeycomb mesh structure, which combined with nanotube-network transistors enables highly robust conformal electronic devices with minimal device-to-device stochastic variations.

Shear adhesion strength of thermoplastic gecko-inspired synthetic adhesive exceeds material limits.

Natural gecko array wearless dynamic friction has recently been reported for 30,000 cycles on a smooth substrate. Following these findings, stiff polymer gecko-inspired synthetic adhesives have been proposed for high-cycle applications such as robot feet. Here we examine the behavior of high-density polyethylene (HDPE) and polypropylene (PP) microfiber arrays during repeated cycles of engagement on a glass surface, with a normal preload of less than 40 kPa.

Nanowire active-matrix circuitry for low-voltage macroscale artificial skin.

Large-scale integration of high-performance electronic components on mechanically flexible substrates may enable new applications in electronics, sensing and energy. Over the past several years, tremendous progress in the printing and transfer of single-crystalline, inorganic micro- and nanostructures on plastic substrates has been achieved through various process schemes. For instance, contact printing of parallel arrays of semiconductor nanowires (NWs) has been explored as a versatile route to enable fabrication of high-performance, bendable transistors and sensors.