Integrated electrode and high density feedthrough system for chip-scale implantable devices.

High density feedthroughs have been developed which allow for the integration of chip-scale features and electrode arrays with up to 1141 stimulating sites to be located on a single implantable package. This layered technology displays hermetic properties and can be produced from as little as two laminated 200 μm thick alumina sheets. It can also be expanded to a greater number of layers to allow flexible routing to integrated electronics.