High Acoustic Impedance and Attenuation Backing for High-Frequency Focused P(VDF-TrFE)-Based Transducers.

Backing materials with tailored acoustic properties are beneficial for miniaturized ultrasonic transducer design. Whereas piezoelectric P(VDF-TrFE) films are common elements in high-frequency (>20 MHz) transducer design, their low coupling coefficient limits their sensitivity. Defining a suitable sensitivity-bandwidth trade-off for miniaturized high-frequency applications requires backings with impedances of >25 MRayl and strongly attenuating to account for miniaturized requirements.

Inkjet-printed P(VDF-TrFE) film for high-frequency annular array.

An innovative processing to deposit P(VDF-TrFE) film on silicon wafers by an inkjet printing method was used to fabricate high-frequency annular array prototype. This prototype has a total aperture of 7.3 mm and 8 active elements.