This study is focused on the quantitative estimation of defect depth by applying pulsed thermal nondestructive testing. The majority of known defect characterization techniques are based on 1D heat conduction solutions, thus being inappropriate for evaluating defects with low aspect ratios. A novel method for estimating defect depth is proposed by taking into account the phenomenon of 3D heat diffusion, finite lateral size of defects and the thermal reflection coefficient at the boundary between a host material and defects.
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