A new method for the detection of void-disbonds at the interfaces of adhesively bonded joins is considered. Based on a simple plane wave model, the output waveform is presented as a sum of two responses associated with the reflection of the ultrasonic wave at the first metal-adhesive interface and the second metal-adhesive interface, respectively. The strong response produced by the wave reverberating in the first metal sheet is eliminated through comparison between the pulse-echo signal measured at the area under the test and reference waveform recorded for the bare first metal sheet outside of the joint.
View Article and Find Full Text PDFA new method of measuring velocity and attenuation of leaky surface waves is presented. A single focused transmitting transducer and linear receiving array in a pitch-catch arrangement are used in the proposed system. The spatial distribution of the acoustic field in the leaky wave is recorded by the array, and the parameters of the leaky wave can be obtained by processing the output waveforms.
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