Interfacial Stability in BiTe Thermoelectric Joints.

Bismuth telluride (BiTe)-based thermoelectric materials are well-known for their high figure-of-merit ( value) in the low-temperature region. Stable joints in the module are essential for creating a reliable device for long-term applications. This study used electroless Co-P to prevent a severe interfacial reaction between the joints of solder and BiTe.