Manufacturing of quantum-tunneling MIM nanodiodes via rapid atmospheric CVD in terahertz band.

Quantum-tunneling metal-insulator-metal (MIM) diodes have emerged as a significant area of study in the field of materials science and electronics. Our previous work demonstrated the successful fabrication of these diodes using atmospheric pressure chemical vapor deposition (AP-CVD), a scalable method that surpasses traditional vacuum-based methods and allows for the fabrication of high-quality AlO films with few pinholes. Here, we show that despite their extremely small size 0.

Nano Groove and Prism-Structured Triboelectric Nanogenerators.

Enhancing the output power of triboelectric nanogenerators (TENGs) requires the creation of micro or nano-features on polymeric triboelectric surfaces to increase the TENGs' effective contact area and, therefore, output power. We deploy a novel bench-top fabrication method called dynamic Scanning Probe Lithography (d-SPL) to fabricate massive arrays of uniform 1 cm long and 2.5 µm wide nano-features comprising a 600 nm deep groove (NG) and a 600 nm high triangular prism (NTP).

Built-In Packaging for Two-Terminal Devices.

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues.

Control over Charge Carrier Mobility in the Hole Transport Layer Enables Fast Colloidal Quantum Dot Infrared Photodetectors.

Solution-processed colloidal quantum dots (CQDs) are promising materials for photodetectors operating in the short-wavelength infrared region (SWIR). Devices typically rely on CQD-based hole transport layers (HTL), such as CQDs treated using 1,2-ethanedithiol. Herein, we find that these HTL materials exhibit low carrier mobility, limiting the photodiode response speed.

Built-In Packaging for Single Terminal Devices.

An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources.