Integrated Hybrid Sub-Aperture Beamforming and Time-Division Multiplexing for Massive Readout in Ultrasound Imaging.

This paper demonstrates hybrid sub-aperture beamforming (SAB) with time-division multiplexing (TDM) for massive interconnect reduction in ultrasound imaging systems. A single-chip front-end system prototype has been fabricated in 180-nm HV BCD technology that combines 5×1 SAB with 8×1 TDM to efficiently reduce the number of receive signal interconnects by a factor of 40. The system includes on-chip high-voltage (HV) pulsers capable of generating unipolar pulses up to 70 V in transmit (TX) mode.

An Adaptive Element-Level Impedance-Matched ASIC With Improved Acoustic Reflectivity for Medical Ultrasound Imaging.

This paper presents an active impedance matching scheme that tries to optimize electrical power transfer and acoustic reflectivity in ultrasound transducers. Leveraging negative capacitance-based impedance matching would potentially improve the bandwidth and electrical power transfer while minimizing acoustic reflection of transducer elements and improve uniformity while reducing acoustic crosstalk of transducer arrays. A 16-element transceiver front-end is designed which employs an element-level active capacitive impedance cancellation scheme using an element-level negative impedance converter.

Analysis of Negative Capacitance-Based Broadband Impedance Matching for CMUTs.

Tight integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with integrated circuits can make active impedance matching feasible for practical imaging devices. In this article, negative capacitance-based impedance matching for CMUTs is investigated. Simple equivalent circuit model-based calculations show the potential of negative capacitance matching for improving the bandwidth along with electrical power transfer and acoustic reflectivity, but the model has limitations especially for acoustic reflectivity evaluation.

A Power-Efficient Bridge Readout Circuit for Implantable, Wearable, and IoT Applications.

A power-efficient bridge-to-digital sensing interface is proposed, which also offers immunity against power supply noise. The interface utilizes duty-cycling to reduce the static power consumption of resistive bridge sensors, which are commonly used in implantable, wearable, and internet of things (IoT) applications, such as intracranial pressure (ICP) sensing and blood pressure (BP) monitoring. The proposed interface uses a revised version of the pseudo-pseudo differential (PPD) topology with the ping-pong technique to reduce the complexity of traditional fully-differential counterparts.

Highly Integrated Guidewire Ultrasound Imaging System-on-a-Chip.

In this article, we present a highly integrated guidewire ultrasound (US) imaging system-on-a-chip (GUISoC) for vascular imaging. The SoC consists of a 16-channel US transmitter (Tx) and receiver (Rx) electronics, on-chip power management IC (PMIC), and quadrature sampler. Using a synthetic aperture imaging algorithm, a Tx/Rx pair, connected to capacitive micromachined ultrasound transducers (CMUTs), can be activated at any time.

An Impulse Radio PWM-Based Wireless Data Acquisition Sensor Interface.

A sensor interface circuit based on impulse radio pulse width modulation (IR-PWM) is presented for low power and high throughput wireless data acquisition systems (wDAQ) with extreme size and power constraints. Two triple-slope analog-to-time converters (ATC) convert two analog signals, each up to 5 MHz in bandwidth, into PWM signals, and an impulse radio (IR) transmitted (Tx) with an all-digital power amplifier (PA) combines them while preserving the timing information by transmitting impulses at the PWM rising and falling edges. On the receiver (Rx) side, an RF-LNA followed by an envelope detector recovers the incoming impulses, and a T-flipflop reverts the impulse sequence back to PWM to be digitized by a time-to-digital converter (TDC).