Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits.

Adhesive bonding requires adequate surface preparation for ensuring an appropriate joint quality. The interest in adhesive joining has recently expanded to thermal systems having a large number of joints employed for manufacturing and assembly. This study presents surface topology of copper 110 produced by a laser-interference setup that would theoretically yield a periodicity of 1.

Transfer-matrix formalism for the calculation of optical response in multilayer systems: from coherent to incoherent interference.

We present a novel way to account for partially coherent interference in multilayer systems via the transfer-matrix method. The novel feature is that there is no need to use modified Fresnel coefficients or the square of their amplitudes to work in the incoherent limit. The transition from coherent to incoherent interference is achieved by introducing a random phase of increasing intensity in the propagating media.