Simulation of Mechanical Stresses in BaTiO Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models.

Multilayer ceramic capacitors (MLCCs) are critical components when thermal processes such as reflow desoldering are used during rework of electronic assemblies. The capacitor's ferroelectric BaTiO body is very brittle. Therefore, thermomechanical stresses can cause crack formation and create conductive paths that may short the capacitor.