High Thermoelectric Performance in Cu-Doped BiTeSe Due to Cl Doping and Multiscale AgBiSe.

The thermoelectric performance of n-type BiTe needs further enhancement to match that of its p-type BiTe counterpart and should be considered for competitive applications. Combining Cu/Cl and multiscale additives (AgBiSe) presents a suitable route for such enhancement. This is evidence of the enhanced thermoelectric performance of BiCuTeSeCl.

High Thermoelectric Performance in AgBiSe-Incorporated n-Type BiTeSeCl.

Bismuth telluride-based (BiTe) alloys have long been considered the best thermoelectric (TE) materials at room temperature. However, the n-type BiTe alloys always exhibit poor thermoelectric performance than their p-type counterpart, which severely limits the energy conversion efficiency of thermoelectric devices. Here, we demonstrate that incorporating AgBiSe can concurrently regulate the electrical and thermal transport properties as well as improve the mechanical performance of n-type BiTeSeCl for high thermoelectric performance.

Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy.

The sharp reduction in size and increase in power density of next-generation integrated circuits lead to electromagnetic interference and heat failure being a key roadblock for their widespread applications in polymer-based electronic packaging materials. This work demonstrates a multifunctional epoxy-based composite (MDCF@LDH/EP) with high electromagnetic wave (EMW) absorption, thermal conductivity, and flame retardancy performance. In which, the synergistic effect of porous structure and heterointerface promotes the multiple reflection and absorption, and dielectric loss of EMW.