Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration.

This paper presents a novel substrateless packaging solution for the D-band active e mixer MMIC module, using a waveguide line with a glide-symmetric periodic electromagnetic bandgap (EBG) hole configuration. The proposed packaging concept has the benefit of being able to control signal propagation behavior by using a cost-effective EBG hole configuration for millimeter-wave- and terahertz (THz)-frequency-band applications. Moreover, the mixer MMIC is connected to the proposed hollow rectangular waveguide line via a novel wire-bond wideband transition without using any intermediate substrate.