High heat fluxes generated in electronics and semiconductor packages require materials with high thermal conductivity to effectively diffuse the heat and avoid local hotspots. Engineered heat spreading materials typically exhibit anisotropic conduction behavior due to their composite construction. The design of thermal management solutions is often limited by the lack of fast and accurate characterization techniques for such anisotropic materials.
View Article and Find Full Text PDFWith advances in flexible and wearable device technology, thermal regulation will become increasingly important. Fabrics and substrates used for such applications will be required to effectively spread any heat generated in the devices to ensure user comfort and safety, while also preventing overheating of the electronic components. Commercial fabrics consisting of ultra-high molecular weight polyethylene (UHMW-PE) fibers are currently used in personal body armor and sports gear owing to their high strength, durability, and abrasion resistance.
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