Implementation of microcontroller board on a sustainable and degradable PLA/flax composite substrate: a case study.

In this paper, we present a novel polylactic-acid/flax-composite substrate and the implementation of a demonstrator: a microcontroller board based on commercial design. The substrate is developed for printed circuit board (PCB) applications. The pre-preg is biodegradable, reinforced, and flame-retarded.

Personal Air-Quality Monitoring with Sensor-Based Wireless Internet-of-Things Electronics Embedded in Protective Face Masks.

In this paper, the design and research of a sensor-based personal air-quality monitoring device are presented, which is retrofitted into different personal protective face masks. Due to its small size and low power consumption, the device can be integrated into and applied in practical urban usage. We present our research and the development of the sensor node based on a BME680-type environmental sensor cluster with a wireless IoT (Internet of Things)-capable central unit and overall low power consumption.

Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors.

In this paper, we investigated the applicability of ChatGPT AI in electronics research and development via a case study of applied sensors in embedded electronic systems, a topic that is rarely mentioned in the recent literature, thus providing new insight for professionals and academics. The initial electronics-development tasks of a smart home project were prompted to the ChatGPT system to find out its capabilities and limitations. We wanted to obtain detailed information on the central processing controller units and the actual sensors usable for the specific project, their specifications and recommendations on the hardware and software design flow additionally.

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints.

Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment.