Life cycle assessment of Japanese high-temperature conductive adhesives.

The electrically conductive adhesives (ECA) are on the verge of a breakthrough as reliable interconnection materials for electronic components. As the ban of lead (Pb) in the electronics industry becomes a reality, the ECA's could be attractive overall alternatives to high melting point (HMP) Pb-based solder pastes. Environmental life cycle assessment (LCA) was used to estimate trade-offs between the energy use and the potential toxicity of two future types of ECA's and one HMP Pb-based.