Solid-state batteries have the potential to replace the current generation of liquid electrolyte batteries. However, the major limitation resulting from their solid-state architecture is the gradual loss of ionic conductivity due to the loss of physical contact between the individual battery components during charging/discharging. This is mainly due to mechanical stresses caused by volume changes in the cathode and anode during lithiation and delithiation.
View Article and Find Full Text PDFNanomaterials play an important role in metal matrix composites (MMC). In this study, 3.0 wt.
View Article and Find Full Text PDFThis study is aimed to evaluate the influence of mechanical surface treatment on the degradation response, cell survival, adhesion, and proliferation of a TiMg composite material. Two sets of the TiMg samples with different surface characteristics were studied: i) as-machined samples (TiMg-T) and ii) samples with a mechanically modified surface (TiMg-P). Surface roughness was determined using a confocal microscope.
View Article and Find Full Text PDFThe current study reflects the demand to mitigate the environmental issues caused by the waste from the agriculture and food industry. The crops that do not meet the supply chain requirements and waste from their processing are overfilling landfills. The mentioned wastes contain cellulose, which is the most abundant carbon precursor.
View Article and Find Full Text PDFMetallic implant materials are biomaterials that have experienced major development over the last fifty years, yet some demands posed to them have not been addressed. For the osseointegration process and the outcome of endosseous implantation, it is crucial to reduce the stress shielding effect and achieve sufficient biocompatibility. Powder metallurgy (PM) was utilized in this study to fabricate a new type of titanium (Ti) + magnesium (Mg) bioactive composite to enable stress-shielding reduction and obtain better biocompatibility compared with that of the traditional Ti and Ti alloys used for dental implants.
View Article and Find Full Text PDFActually, MgB is the lightest superconducting compound. Its connection with lightweight metals like Ti (as barrier) and Al (as outer sheath) would result in a superconducting wire with the minimal mass. However, pure Al is mechanically soft metal to be used in drawn or rolled composite wires, especially if applied for the outer sheath, where it cannot provide the required densification of the boron powder inside.
View Article and Find Full Text PDFBackground: The innovative titanium-magnesium composite (Ti-Mg) was produced by powder metallurgy (P/M) method and is characterized in terms of corrosion behavior.
Material And Methods: Two groups of experimental material, 1 mass% (Ti-1Mg) and 2 mass% (Ti-2Mg) of magnesium in titanium matrix, were tested and compared to commercially pure titanium (CP Ti). Immersion test and chemical analysis of four solutions: artificial saliva; artificial saliva pH 4; artificial saliva with fluoride and Hank balanced salt solution were performed after 42 days of immersion, using inductively coupled plasma mass spectrometry (ICP-MS) to detect the amount of released titanium ions (Ti).
Acta Stomatol Croat
December 2014
Purpose: Commercially pure titanium (CP Ti) has been recognized in dentistry for its biocompatibility, good mechanical properties and corrosion resistance. Conventional manufacturing processes can affect surface quality and result in poor bonding of dental ceramics to CP Ti. This is why powder metallurgy (P/M) and wire electro-discharge machining (WEDM) are being introduced in the manufacturing process.
View Article and Find Full Text PDFThis paper describes the influence of the transition distortion of gradient amplifiers on direct Fourier NMR imaging techniques. We demonstrate artifacts arising in the real measurement of the spin density images. Image artifacts are compared with artifacts obtained by computer simulations of the transition distortion of gradient amplifiers.
View Article and Find Full Text PDFMed Biol Eng Comput
November 1981